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Introduction of our company handling product

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Our company is doing the design & production of solder reflow oven and also clean cure oven for the electronic device and the print circuit board
We have poured our power in the development of nitrogen reflow oven in purpose of the prevention of oxidization or the improvement of the soldering in heating.
Recently, also pouring power in the development of reflow oven for lead-free solder correspondence.
We are doing even the design & production of reflow oven for the ball formation of BGA/CSP package or wafer bump formation of Flip-tip device process in a field of semiconductor.
Besides crossing in 10 years, we are doing the production and sales a pre-baking cure oven and a drying oven for LCD/PDP.
These products are introducing to all of you at the exhibition of "Semicon Japan","Process technology Japan"





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